Die bonder mold temperature measurement

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Since the mold of semiconductor manufacturing equipment such as a die bonder is greatly influenced by the quality of the product, it is important to measure the surface temperature of the mold.
By using our "Handheld thermometer" and "High superior micro surface temperature probe", it is possible to measure the temperature with high precision in a micro spot.
The high-performance micro surface temperature probe has a very fast response speed of 1 second and highly durable.

Handheld Thermometer

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HR-1250K

HR series handheld thermometers allow easy temperature measurement.
These general-purpose thermometers can be used for on-site temperature measurement and various other applications.
*Waterproof specifications : Equivalent to IPX5

High Superior for extremely small Surface Probes

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S-423K-01-1-TPC1-ANP